EUV Lithography Market - By System Type (High-NA EUV, Low-NA EUV, Multi-Beam Mask Writer), By Application (Logic, Memory, Compound Semiconductor), By Region

The global EUV lithography market size was USD 9.51 Billion in 2025 and is expected to register a revenue CAGR of 12.9% during the forecast period. Extreme ultraviolet lithography uses 13.5-nanometre wavelength light generated by tin plasma illuminated by CO2 lasers to pattern semiconductor features below 10 nanometres through reflection from multilayer molybdenum-silicon coated optics and masks, enabling logic and memory device patterning at 3-nanometre and below nodes without the resolution-limiting multiple patterning required by 193-nanometre DUV lithography. ASML Holding N.V. is the sole manufacturer of commercial EUV scanners globally, with its NXE:3400C platform in production use at TSMC, Samsung, and Intel Foundry for 3nm and 5nm node patterning, and its NXE:3600D platform delivering 200 wafers per hour at 3-nanometre specifications. ASML reported EUV system revenue of EUR 8.3 billion in 2024, representing 54 percent of total ASML revenue, and disclosed an installed EUV scanner base of approximately 200 systems across all customer facilities. The Semiconductor Industry Association reported that leading-edge logic semiconductor manufacturing concentrated at TSMC's 3nm and 2nm nodes and Samsung Foundry's 3nm GAA node each require 18 to 25 EUV exposure steps per wafer.

The EUV lithography market is at the transition from NXE low-NA EUV at 0.33 numerical aperture to High-NA EUV at 0.55 numerical aperture, with ASML's EXE:5000 High-NA system shipped to Intel Foundry in 2024 as the first production-capable High-NA EUV scanner. High-NA EUV resolves features below 8 nanometres half-pitch, enabling the gate-all-around transistor structures and backside power delivery networks required for 1-nanometre and below logic node production. For instance, in January 2026, ASML Holding N.V., Netherlands, disclosed that cumulative High-NA EUV scanner shipments had reached 6 units to Intel Foundry, TSMC, and Samsung Foundry, with a disclosed production target of 20 High-NA units for 2026, confirming the ramp of the industry's most expensive semiconductor manufacturing tool at USD 350 million per system. These are some of the key factors driving revenue growth of the market.

However, ASML's monopoly on EUV scanner production creates a single-point supply risk for the entire leading-edge semiconductor manufacturing ecosystem, with any disruption to ASML's Veldhoven production facility or its supply chain of precision optical components, laser systems, and vacuum stages creating potential multi-quarter delays for TSMC and Samsung foundry capacity additions. High-NA EUV's adoption is slowed by anamorphic optics that expose only half the field area of low-NA EUV per scan, requiring photoresist dose improvements and stochastic defect reduction to achieve the yield needed for commercial production economics. These factors substantially limit EUV lithography market growth over the forecast period.